Nitrogen effectively displaces oxygen in the environment. By purging the dicing area with nitrogen, the concentration of oxygen is reduced, minimizing the risk of oxidation.
Nitrogen gas helps in controlling moisture levels, preventing the formation of condensation and microbial contamination.
By reducing the chances of wafer damage, nitrogen-enhanced wafer dicing can significantly improve yield rates in semiconductor manufacturing.
Nitrogen effectively displaces oxygen in the environment. By purging the dicing area with nitrogen, the concentration of oxygen is reduced, minimizing the risk of oxidation.
Nitrogen gas helps in controlling moisture levels, preventing the formation of condensation and microbial contamination.
By reducing the chances of wafer damage, nitrogen-enhanced wafer dicing can significantly improve yield rates in semiconductor manufacturing.